Applications

Backgrind tape

Protect the frontside of the wafer during grind and other steps

Dicing tape

Hold wafers when being cut into individual dies

Die attach film

Bond die to die, die to substrate, or other configuration

Metal liftoff tape

Peel off metallized layers instead of using aggressive chemistries

Taping equipment

Laminate tape, peel or remove tape, UV cure, and other functions

Tape transfer

Use tapes’ different adhesive strength to move dies from one tape to another

Heat release tape

Apply heat to release substrate from the tape

Heat resistant tape

Protect or hold wafers during high temperature processes